Analysis
September 13, 2022
Intel Breaks Ground on Ohio Semiconductor Facility
Written by Becca Moczygemba
Intel broke ground on its new chipmaking facility on Sept. 9. The Licking County, Ohio, site will be the company’s newest manufacturing site built in 40 years.
In conjunction with the new facility, Intel is establishing the Ohio Semiconductor Education and Research Program as a means to develop skilled workers for the new plants.
“Today marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain. The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit US economic and national security. We would not be here today without the support of leaders in the administration, Congress and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking,” stated Intel CEO Pat Gelsinger in a press release.
In addition to the investment in Ohio, Intel has opened a developmental factory in Oregon for the further development of transistors, wafer processes and packaging technology. The company also intends to build two new fabs in Arizona and expand packaging capabilities into New Mexico. The combination of research and development with the new locations will broaden the organization’s “lab-to-fab” supply chain.
Intel is a designer and manufacturer of semiconductors and cloud technology based in Santa Clara, Calif.
By Becca Moczygemba, Becca@SteelMarketUpdate.com
